Substrate carrier having door latching and substrate clamping mechanisms

ABSTRACT

In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3) a tunnel. The tunnel is adapted to extend from an opening in a clean room wall toward the platform and at least partially surround the platform. The tunnel is further adapted to direct a flow of air from the clean room wall toward the platform and out of the tunnel. Numerous other aspects are provided.

This application is a continuation of and claims priority from U.S.patent application Ser. No. 10/650,311 filed Aug. 28, 2003 now U.S. PatNo. 6,955,197, which claims priority from U.S. provisional applicationSer. No. 60/407,340, filed Aug. 31, 2002. Both of these patentapplications are hereby incorporated by reference herein in theirentirety.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is related to the following commonly-assigned,co-pending U.S. patent applications, each of which is herebyincorporated by reference herein in its entirety:

U.S. Provisional Patent Application Ser. No. 60/407,451, filed Aug. 31,2002 and titled “System For Transporting Wafer Carriers”;

U.S. Provisional Patent Application Ser. No. 60/407,339, filed Aug. 31,2002 and titled “Method and Apparatus for Using Wafer Carrier Movementto Actuate Wafer Carrier Door Opening/Closing”;

U.S. Provisional Patent Application Ser. No. 60/407,474, filed Aug. 31,2002 and titled “Method and Apparatus for Unloading Wafer Carriers fromWafer Carrier Transport Systems”;

U.S. Provisional Patent Application Ser. No. 60/407,336, filed Aug. 31,2002 and titled “Method and Apparatus for Supplying Wafers to aProcessing Tool”;

U.S. Provisional Patent Application Ser. No. 60/407,452, filed Aug. 31,2002 and titled “End Effector Having Mechanism For Reorienting A WaferCarrier Between Vertical And Horizontal Orientations”;

U.S. Provisional Patent Application Ser. No. 60/407,337, filed Aug. 31,2002, and titled “Wafer Loading Station with Docking Grippers at DockingStations”;

U.S. Provisional Patent Application Ser. No. 60/443,087, filed Jan. 27,2003 and titled “Method and Apparatus for Transporting Wafer Carriers”;

U.S. Patent Application Ser. No. 60/407,463, filed Aug. 31, 2002 andtitled “Wafer Carrier Handler That Unloads Wafer Carriers Directly Froma Moving Conveyor”.

U.S. Patent Application Ser. No. 60/443,004, filed Jan. 27, 2003 andtitled “Wafer Carrier Handler That Unloads Wafer Carriers Directly Froma Moving Conveyor”.

U.S. Provisional Patent Application Ser. No. 60/443,153, filed Jan. 27,2003 and titled “Overhead Transfer Flange and Support for SuspendingWafer Carrier”;

U.S. Provisional Patent Application Ser. No. 60/443,001, filed Jan. 27,2003 and titled “Systems and Methods for Transferring Wafer CarriersBetween Processing Tools”; and

U.S. Provisional Patent Application Ser. No. 60/443,115, filed Jan. 27,2003 and titled “Apparatus and Method for Storing and Loading WaferCarriers”.

FIELD OF THE INVENTION

The present invention relates generally to substrate processing, andmore particularly to substrate carriers and apparatus and methods forinterfacing the same to a processing tool.

BACKGROUND OF THE INVENTION

Semiconductor devices are formed on substrates, such as siliconsubstrates, glass plates or the like, often termed wafers, for use incomputers, monitors, etc. These devices are formed by a sequence offabrication steps, such as thin film deposition, oxidation, etching,polishing and thermal and lithographic processing. Although multiplefabrication steps often may be performed in a single processingapparatus, substrates typically must be transported between differentprocessing tools for at least some of the fabrication steps required fordevice fabrication.

Substrates generally are stored in carriers for transfer betweenprocessing tools and other locations. In many cases substrate carrierscompletely enclose the substrate or substrates contained therein in astationary volume of air or other gas, to reduce the risk of particulatecontamination of the substrates. A conventional substrate carriergenerally has a door that must be opened and/or removed to permit asubstrate to be extracted from the substrate carrier when the substratecarrier is interfaced to a processing tool.

It may be desirable to provide a latching mechanism for a substratecarrier, to assure that the door of the carrier remains closed at timeswhen the door is intended to be closed (e.g., during transport). It alsomay be desirable to provide a clamping mechanism in a substrate carrierto assure that each substrate remains stationary within the carrierhousing while the carrier is being transported to or from a processingtool. Such latching and clamping mechanisms typically require numerousactuators and the use of specially designed keys which increase the costand complexity of substrate carriers. A more simplified, cost effectivesubstrate carrier would be advantageous.

SUMMARY OF THE INVENTION

In a first aspect of the invention, an automatic door opener is providedthat includes (1) a platform adapted to support a substrate carrier; (2)a door opening mechanism adapted to open a door of the substrate carrierwhile the substrate carrier is supported by the platform; and (3) atunnel. The tunnel is adapted to extend from an opening in a clean roomwall toward the platform and at least partially surround the platform.The tunnel is further adapted to direct a flow of air from the cleanroom wall toward the platform and out of the tunnel.

In a second aspect of the invention, a method of loading a substrateinto a processing tool is provided. The method includes the steps of (1)loading a substrate carrier onto a platform positioned adjacent a cleanroom wall that separates the platform from the processing tool; (2) atleast partially surrounding the substrate carrier with a tunnel thatextends from an opening in the clean room wall toward the platform; (3)opening a door of the substrate carrier while the substrate carrier issupported by the platform; and (4) directing a flow of air from theclean room wall toward the platform and out of the tunnel.

In a third aspect of the invention, an apparatus is provided forunlatching a substrate carrier. The apparatus comprises (1) a substratetransfer location including a support structure adapted to support asubstrate carrier; and (2) an actuator mechanism positioned relative tothe support structure. The actuator mechanism is adapted to interactwith a latching mechanism of a substrate carrier supported by thesupport structure, so as to employ a movement of the substrate carrierto actuate unlatching of the substrate carrier.

In a fourth aspect of the invention, an apparatus is provided forreleasing a substrate clamping mechanism of a substrate carrier. Theapparatus comprises (1) a substrate transfer location including asupport structure adapted to support a substrate carrier; and (2) anactuator mechanism positioned relative to the support structure. Theactuator mechanism is adapted to interact with a substrate clampingmechanism of a substrate carrier held by the support structure, so as toemploy a movement of the substrate carrier to actuate releasing of thesubstrate clamping mechanism.

In a fifth aspect of the invention, an apparatus is provided forunlatching a substrate carrier and for releasing a substrate clampingmechanism of the substrate carrier by employing both features of thefirst and second aspects of the invention. Numerous other aspects areprovided, and are systems and methods for carrying out the same.

The term “latching mechanism” as used herein and in the appended claimswill be understood to mean a mechanism which applies a force to a doorof a substrate carrier to hold the door in a closed position. “Latching”refers to holding a door of a substrate carrier in a closed position.“Unlatching” refers to allowing a door of a substrate carrier to open(whether or not the door is actually opened).

With the apparatus and methods of the present invention, the door of asubstrate carrier can be securely closed, notwithstanding gravitationalor other forces that might tend to open the door. Also in accordancewith the invention a substrate clamping mechanism included in asubstrate carrier may assure that a substrate is maintained at a stableposition within the substrate carrier during transporting of thesubstrate carrier. This may prevent unintended contact between thesubstrate and the interior of the substrate carrier, thereby reducingthe possibility of particulate contamination or damage of the substrate.In accordance with one or more embodiments of the invention, thesefeatures are provided with fewer actuators or the use of speciallydesigned keys employed with many conventional substrate carriers.

Further features and advantages of the present invention will becomemore fully apparent from the following detailed description, theappended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side elevational view showing a substrate transferlocation provided in accordance with the invention;

FIGS. 2A and 2B are isometric views of a substrate carrier provided inaccordance with the present invention, respectively showing theinventive substrate carrier in a closed condition and in an opencondition;

FIG. 2C is a side view of the substrate carrier of FIG. 2B;

FIG. 3 is an enlarged partial side view showing some of the componentsof the inventive substrate carrier of FIGS. 2A-2B when the inventivesubstrate carrier is in a closed and latched condition;

FIG. 4A is an isometric view of a carrier opening mechanism provided inaccordance with the invention as part of the substrate transfer locationof FIG. 1;

FIG. 4B is an enlarged isometric view showing a portion of the view ofFIG. 4A;

FIG. 4C is a front plan view of the carrier opening mechanism of FIG. 4Ahaving the substrate carrier of FIGS. 2A-2C positioned therein;

FIG. 5A is a schematic isometric view showing a clamping mechanismprovided in accordance with the invention and included in the substratecarrier of FIGS. 2A-2B;

FIG. 5B is an enlarged schematic isometric view showing a portion of theview of FIG. 5A;

FIG. 5C is an isometric view of an embodiment of the substrate carrierof FIGS. 2A-2B wherein a lid of the substrate carrier is removed andclamping members are clamping a substrate;

FIG. 5D is a magnified isometric view, showing details of a portion ofFIG. 5C;

FIG. 6A is a partial side view showing a clamping member of the clampingmechanism of FIGS. 5A and 5B in clamping contact with a substrate;

FIG. 6B is a cross sectional view of the substrate carrier of FIG. 5Cwherein an alternative clamping member configuration is employed;

FIG. 6C is a magnified isometric view showing details of a portion ofFIG. 6B;

FIGS. 7A and 7B respectively are views similar to FIGS. 5A and 5B,showing the inventive substrate clamping mechanism in a releasedcondition;

FIG. 7C is a cross sectional view similar to FIG. 6B, but with theclamping members retracted;

FIG. 7D is a magnified isometric view showing details of a portion ofFIG. 7C;

FIG. 7E is an isometric view of an embodiment of the substrate carrierwherein a lid of the substrate carrier is removed and clamping membersare retracted from a substrate; and

FIG. 8 is an isometric view of an alternative embodiment of a substrateloading station that includes a substrate carrier handler that may beemployed with the present invention.

DETAILED DESCRIPTION

In accordance with the present invention, a door latching mechanism of asubstrate carrier is automatically unlatched by interaction of thelatching mechanism with an actuator mechanism at a substrate transferlocation (e.g., of a processing tool that may be used, for example,during semiconductor device manufacturing). The same actuator mechanismalso may release a substrate clamping mechanism that may be part of thesubstrate carrier (e.g., and that secures a substrate stored by thesubstrate carrier during transport).

FIG. 1 is a schematic side elevational view which shows a processingtool and an associated factory interface that includes a substratetransfer location provided in accordance with the invention. In FIG. 1,reference numeral 100 indicates a schematic representation of aprocessing tool.

As is familiar to those who are skilled in the art, the processing tool100 may include one or more load locks, one or more transfer chambers,and/or one or more processing chambers associated with the one or moretransfer chambers. None of these features are separately shown. It willbe appreciated that, in the processing chambers, one or moresemiconductor device fabrication processes may be applied to substratesthat are loaded into the processing tool 100.

A factory interface (FI) 102 is coupled to the processing tool 100 toprovide an interface between the processing tool 100 and one or moresubstrate carriers that contain substrates to be loaded into theprocessing tool 100. The factory interface 102 includes a clean roomwall 103 which separates the interior of the factory interface 102 froma clean room environment 105. The factory interface 102 includes a port104 through which one or more substrates may be transferred into thefactory interface 102. More than one port 104 may be employed. Anoptional door 106 may selectively close the port 104 of the factoryinterface 102. (In one embodiment of the invention, the door 106 shownin FIG. 1 may be dispensed with, and the factory interface 102 may havea positive interior pressure such that a constant flow of gas exits thefactory interface 102 through the port 104. The positive interiorpressure of the factory interface 102 thereby acts to deterparticles/contaminants from entering the factory interface 102.) Apositive static pressure may be maintained within the factory interface102, for example, via a flow of filtered air through the factoryinterface (e.g., from a top of the factory interface to a bottom of thefactory interface) and with the use of HEPA, ULPA or similar cleanroomgrade filters known in the art. In one embodiment of the invention, a0.005-0.2 inches of water pressure differential between the inside andoutside of the factor interface 102 may be employed (e.g., usingrecirculated, filtered ambient air).

A substrate transfer location 108 is provided in accordance with theinvention outside the factory interface 102 (e.g., at an outer side ofthe door 106 and the port 104). The substrate transfer location 108includes a substrate carrier support structure such as a supportplatform 110, on which an inventive substrate carrier 112 (describedfurther below) may be supported.

Associated with the support platform 110 is a carrier moving mechanism114, such as a motorized stage or pneumatic cylinder, which is adaptedto move the substrate carrier 112 toward and away from the port 104 ofthe factory interface 102. It will be understood that alternatively asubstrate carrier may be supported via a gripper (not shown) that gripsthe substrate carrier, for example, via an overhead transfer flange (notshown) of the substrate carrier to thereby suspend the substratecarrier. Either the gripper or the support 110 may include one or morekinematic features (e.g., kinematic pins, mounts or the like) to aid insubstrate carrier positioning.

In FIG. 1, reference numeral 116 schematically represents a door oropenable portion of the substrate carrier 112. Not separately shown inFIG. 1 are an actuator mechanism (described below) included in thesubstrate transfer location 108, and a latching mechanism (describedbelow) provided on the substrate carrier 112. In accordance with atleast one embodiment of the invention, a motion of the substrate carrier112 causes the actuator mechanism of the substrate transfer location 108to interact with the latching mechanism of the substrate carrier 112 tounlatch the openable portion 116 of the substrate carrier 112. Theinteraction of the actuator mechanism of the substrate transfer location108 and the latching mechanism of the substrate carrier 112 also mayserve to release a substrate clamping mechanism (not shown in FIG. 1) ofthe substrate carrier 112. The actuator mechanism of the substratetransfer location 108, and the latching mechanism and the substrateclamping mechanism of the substrate carrier 112 are described furtherbelow with reference to FIGS. 2A-7E.

The factory interface 102 may also include a substrate handling robot,which is not shown, and which is adapted to transfer substrates betweenthe substrate carrier 112 and the processing tool 100.

In the embodiment of FIG. 1, a controller 118 is coupled to the door 106of the factory interface 102 and to the carrier moving mechanism 114 tocontrol operation thereof.

Reference numeral 120 represents one or more substrate carrier storageshelves (for storing one or more substrate carriers) that may be mountedin association with the substrate transfer location 108. For example,the one or more substrate carrier storage shelves 120 may be locatedabove the substrate transfer location 108 as shown.

FIG. 2A is an isometric view of the inventive substrate carrier 112 ofFIG. 1, in a closed condition, and FIG. 2B is a view similar to FIG. 2A,showing the inventive substrate carrier 112 in an opened condition. Theinventive substrate carrier 112 includes a carrier housing 200, in whicha substrate 202 (FIG. 2B) may be contained. The carrier housing 200includes an openable portion 204 including a door 206 which is pivotallymounted to the carrier housing 200. The door 206 pivots between theclosed position shown in FIG. 2A and the opened position shown in FIG.2B.

In accordance with the invention, the inventive substrate carrier 112includes a latching mechanism 208. In at least one embodiment, theinventive latching mechanism 208 may comprise an elongated, tube-likeenclosure 210 arranged along a sidewall 214 of the carrier housing 200,preferably along a lower edge 212 thereof (although other locations maybe employed). The enclosure 210 may, for example, have a square orrectangular cross section. Other shapes may be employed. The enclosure210 may, for example, be integrally formed with or separately formedfrom the carrier housing 200.

As shown in the side view of FIG. 2C, the openable portion 204 of thecarrier housing 200 may have an angled face 216 (e.g., 45° or some othersuitable angle) and the door 206 may have a complimentary angled face218 so that when the door 206 closes, it does so without scrubbingaction relative to the openable portion 204 of the carrier housing.Consequently, the likelihood of generating particles upon closing of thedoor 206 may be reduced. One or both of the angled faces 216, 218 may becovered with an elastomeric material, such as silicone, to affectsealing therebetween.

FIG. 3 is a partial side elevational view of the inventive substratecarrier 112, showing details of an exemplary embodiment of the inventivelatching mechanism 208. The latching action of the latching mechanism208 is provided by interaction between a tab 300 which extends outwardlyfrom a right side 301 (FIG. 2B) of the door 206 and a latch member 302that is slidable within the enclosure 210. In the example shown, the tab300 is positioned above a lower edge 304 (FIG. 3) of the door 206. Thelatch member 302 has an outer end 306 that extends outwardly from amouth 308 of the enclosure 210. The latch member 302 includes a finger310 that extends outwardly from the outer end 306 of the latch member302. The finger 310 is configured so that when the latching mechanism208 is in its latching condition, as shown in FIG. 3 and as describedfurther below, the door 206 is closed (FIGS. 2A and 3) and the finger310 of the latch member 302 underlies the tab 300. In this position, thefinger 310 prevents the tab 300 (and thus the door 206) from pivotingabout a pivot point P relative to the carrier housing 200 (e.g., byapplying an upward force on the tab 300 to keep the door 206 in a closedposition). Specifically, a portion 310 a of the finger 310 contacts aportion 300 a of the tab 300 as shown in FIG. 3.

In at least one embodiment of the invention, the portion 300 a of thetab 300 and/or the portion 310 a of the finger 310 are sloped relativeto a horizontal plane (e.g., at about 10-15°, although other or noangles may be employed). Sloping the portion 310 a of the finger 310provides a vertical force component that may help seal the substratecarrier 112. Sloping the portion 300 a of the tab 300 may reduceparticle generation and/or wear of the tab 300 and/or the finger 310 bymore evenly distributing frictional contact across the surfaces of thetab 300 and finger 310. A low friction coating or contact surface (notshown) also may be added to the tab 300 and/or the finger 310 to reducefrictional interaction between the tab 300 and finger 310 during openingand/or closing of the substrate carrier 112. Examples of such a lowfriction coating/contact surface include polytetrafluoroethylene (PTFE)or Teflon®, a PTFE-like material, other low friction and/or low particlegenerating materials, etc.

The latching mechanism 208 also includes a biasing mechanism such as aspring 312. The spring 312 is held in an inner end 313 of the enclosure210 (e.g., the end opposite to the mouth 308 of the enclosure 210). Thespring 312 pushes against an inner end 314 of the latch member 302 tobias the latch member 302 outwardly (in the direction indicated by arrow316) toward the tab 300 of the door 206 (e.g., toward the latchingposition illustrated in FIG. 3). Other suitable biasing mechanisms maybe similarly employed.

A step 318 is formed on the outer end 306 of the latch member 302 at apoint where the finger 310 emerges from the outer end 306. When thelatching mechanism 208 is in its latching position shown in FIG. 3, thestep 318 of the latch member 302 abuts a side 320 of the tab 300 tolimit the outward movement of the latch member 302.

Referring again to FIGS. 2A and 2B, although only one latching mechanism208, associated with the side wall 214 of the carrier housing 200, isshown in the drawings, it is also contemplated that a second latchingmechanism may be provided in association with an opposite side wall ofthe carrier housing 200 to latch a left side 322 (FIG. 2B) of the door206.

FIG. 4A is an isometric view of one exemplary embodiment of a carrieropening mechanism 400 configured in accordance with the presentinvention. In the exemplary embodiment, the carrier opening mechanism400 may be positioned adjacent, or even within, the port 104 of thefactory interface 102. In general, the carrier opening mechanism 400 maybe employed at any location in which access to the substrate 202 of thesubstrate carrier 112 is desired.

Referring to FIG. 4A, the carrier opening mechanism 400 is shown as itwould be seen looking outward from the interior of the factory interface102 (FIG. 1) through the port 104 toward the substrate transfer location108. FIG. 4B is an enlarged isometric view showing details of a portion401 (FIG. 4A) of the carrier opening mechanism 400. As shown in FIGS.4A, 4B the carrier opening mechanism 400 is generally in a shape thatmatches the substrate carrier 112's profile and provides a smallclearance for clean air flow around the substrate carrier 112 as furtherdescribed below and as represented, for example, by a rectangular tunnel402. Other configurations may be employed. For example, the carrieropening mechanism 400 may comprise two side pieces having actuatingmechanisms (such as those described further below) coupled adjacent theport 104.

With reference to FIG. 4B, a cam slot 404 is formed in a side wall 406of the tunnel 402. As more fully described in previously incorporatedU.S. patent application Ser. No. 60/407,339, filed Aug. 31, 2002 andtitled “Method and Apparatus for Using Wafer Carrier Movement to ActuateWafer Carrier Door Opening/Closing”, the door 206 of the substratecarrier 112 may be provided with a cam follower 408 (FIGS. 2A, 2C and 3)that cooperates with the cam slot 404 of the carrier opening mechanism400 to guide the door 206 to the opened position shown in FIGS. 2B and2C.

As described in the above-referenced co-pending patent application,opening of the door 206 may occur by means of a docking movement of thesubstrate carrier 112 relative to the port 104. As used herein,“docking” or docking movement refers to the inward motion of a substratecarrier toward a port through which substrates are exchanged, such as aport in a clean room wall. Similarly, “undocking” or undocking movementrefers to outward motion of a substrate carrier away from a port throughwhich substrates are exchanged, such as a port in a clean room wall.Arrow 410 in FIG. 4B schematically represents such a docking movement.

As shown in FIG. 4B, a stop 412 is positioned adjacent the side wall 406and the cam slot 404 of the tunnel 402 in a carved-out region 413 of theside wall 406. The carved-out region 413 is configured to accommodatethe latching mechanism 208 (which protrudes from the side walls of thecarrier housing 200 as shown in FIGS. 2A-2C). Also shown in FIGS. 4A-4Bare the carrier moving mechanism 114 (e.g., a sled) juxtaposed with thecarrier opening mechanism 400, and a kinematic pin 414 provided on thecarrier moving mechanism 114 to interact with an alignment feature (notshown) on the bottom of the substrate carrier 112 (FIG. 1) to guide thesubstrate carrier 112 into a correct position on the carrier movingmechanism 114. Typically a plurality of kinematic features (e.g., threeor more) may be employed to aid in positioning the substrate carrier 112relative to the carrier moving mechanism 114. A step 416 is providedadjacent the stop 412 of the carrier opening mechanism 400 for providingstructure to the stop 412 and for controlling air flow around thesubstrate carrier 112 and/or the carrier moving mechanism 114 (asdescribed further below). It will be understood that the opposite sidewall (e.g., side wall 418) of the carrier opening mechanism 400 may besimilarly configured with a cam slot, carved-out region configured toaccommodate a latching mechanism provided on the side of the substratecarrier 112 opposite side 214 in FIGS. 2A-2C, a stop and/or a step.

The stop 412 functions as an actuating mechanism to interact with thelatching mechanism 208 of the substrate carrier 112 (FIG. 3). (Anadditional port stop, not shown in the drawings, provided at side wall418 (FIG. 4A) of the tunnel 402 may interact with a second latchingmechanism (not shown) of the substrate carrier 112.) In particular, as aresult of a docking movement of the substrate carrier 112, the finger310 (FIG. 3) of the latch member 302 comes into contact with the stop412. The substrate carrier 112 may or may not contact the step 416during docking. As the substrate carrier 112 continues to move in thedirection indicated by the arrow 410 (FIG. 4B), motion of the latchmember 302 in that direction is halted by the stop 412, causing thelatch member 302 to be pushed into the enclosure 210 against the biasingforce of the spring 312. As a result, the tab 300 is released from thefinger 310 of the latch member 302, allowing the door 206 to pivot(about point P (FIG. 3)) and to be opened by the above-referencedinteraction of the cam slot 404 (FIG. 4B) and the cam follower 408 (FIG.3).

FIG. 4C is a front plan view of the carrier opening mechanism 400 ofFIG. 4A having the substrate carrier 112 positioned therein. As shown inFIG. 4C, the step 416 may assist in reducing excessive air flow from thefactory interface 102 (FIG. 1) through the port 104 and the carrieropening mechanism 400 by providing a controlled air gap G between thecarrier opening mechanism 400 and the substrate carrier 112 and thecarrier moving mechanism 114 (e.g., so as to establish a laminar airflow therebetween). Such a laminar flow may be generated, for example,by providing an air gap G of between about 0.05 to 0.150 inches. Otherair gap spacings may be employed.

As stated above, positive static pressure may be maintained within thefactory interface 102, for example, via a flow of filtered air throughthe factory interface (e.g., from a top of the factory interface to abottom of the factory interface) and with the use of HEPA, ULPA orsimilar cleanroom grade filters known in the art. In one embodiment ofthe invention, a 0.005-0.2 inches of water pressure differential betweenthe inside and outside of the factory interface 102 may be employed(e.g., using recirculated, filtered ambient air).

In one or more other aspects of the invention, the door 106 (FIG. 1),also referred to herein as a “port door”, may include keys (not shown)or other unlocking and/or door opening mechanisms for unlocking,receiving and supporting the door 116 of the substrate carrier 112 asdescribed, for example, in U.S. Pat. No. 6,082,951 titled “WaferCassette Load Station” which is hereby incorporated by reference hereinin its entirety. The door 106 may move backward away from the platform110 and then lower, carrying the door 116 of the substrate carrier 112therewith as is generally known; alternatively the door 106 may lack anyx-axis movement and the platform 110 instead may move the substratecarrier 112 away from the port 104 (or other similar opening in theclean room wall 103) so that the door 106 may lower (supporting the door116 of the substrate carrier 112) without contacting the substratecarrier 112 as described in above-identified U.S. Pat. No. 6,082,951.The platform 110 then may move the substrate carrier 112 back toward theport 104 (e.g., to allow a substrate to be removed therefrom). In eithercase, in accordance with the present invention, the substrate carrier112 may remain within the tunnel 402 and receive a flow of air (e.g., alaminar flow) from the factory interface 102 as described above.

The laminar flow of air tends to prevent particles from reaching thelocus at which a substrate is withdrawn from the substrate carrier 112to be transferred to the processing tool 100. Note that such a laminarair flow and/or positive pressure factory interface arrangement may beemployed with any substrate carrier (e.g., a single substrate carrier, amultiple-substrate carrier, a front opening substrate carrier, a frontopening unified pod, etc.) and with any substrate carrier doorarrangement, whether or not substrate carrier movement is employed toopen and/or close a substrate carrier door. For example, the presentinvention may be employed to surround an opening through whichsubstrates are transferred between an open substrate carrier and aprocessing tool, so as to generate a laminar air flow from theprocessing tool side past the open substrate carrier (e.g., and out ofthe tunnel 402).

A substrate clamping mechanism that may be included in the inventivesubstrate carrier 112 will now be described with reference to FIGS.5A-7E.

FIG. 5A is a schematic isometric view of an exemplary substrate clampingmechanism 500 provided in accordance with the invention. FIG. 5B is amagnified isometric view, showing details of a portion 502 of FIG. 5A.

The inventive substrate clamping mechanism 500 operates by interactionof clamping members 504 with latch members 302 of the kind describedabove in connection with the latching mechanism 208 (FIG. 3). In oneembodiment of the invention, as shown in FIG. 5A, four clamping members504 are provided, comprising two pairs of clamping members 504, witheach pair of clamping members 504 associated with a respective latchmember 302. Other numbers of clamping members may be employed.

Referring to FIG. 5B, in one embodiment of the invention each clampingmember 504 is generally L-shaped, having a horizontal leg 506 and arelatively short vertical leg 508. Other shapes/configurations may beemployed. In FIG. 5B, a side wall of the carrier housing 200 (FIGS.2A-2C) is schematically represented by a dashed line 214. Each clampingmember 504 may be slidably mounted in a respective aperture 511 (FIG. 2Cand FIG. 5C described below) of the side wall 214 of the carrier housing200.

When the substrate clamping mechanism 500 is in its clamping condition,as illustrated in FIGS. 5A, 5B, an inner side 512 of the latch member302 contacts the vertical leg 508 of the clamping member 504 and holdsthe clamping member 504 such that an end 514 of the horizontal leg 506of the clamping member 504 contacts an edge 516 of the substrate 202.Simultaneous contact of all four clamping members 504 with the substrate202 serves to clamp the substrate 202 (e.g., so as to hold the substrate202 stationary, particularly during transport of the substrate carrier112).

FIG. 5C is an isometric view of an embodiment of the substrate carrier112 wherein a lid (not shown) of the substrate carrier 112 is removed.FIG. 5D is a magnified isometric view, showing details of a portion 517of FIG. 5C. In the embodiment of FIGS. 5C and 5D, the substrate carrier112 includes a hollowed out region 520 having an angled side wallportion 522 and a non-angled side wall portion 524 (FIG. 5D). Thenon-angled side wall portion 524 has a diameter approximately equal tothat of the substrate 202 (e.g., about 0.004 to 0.005 inches larger thanthe substrate 202 in one embodiment, although other dimensions may beemployed), and the angled side wall portion 522 is angled so as toensure accurate positioning of the substrate 202 as the substrate 202 islowered into the non-angled side wall portion 524 of the substratecarrier 112. In at least one embodiment, the angled side wall portion522 has an angle of about 45° from the plane of the substrate 202,although other angles may be employed.

In FIGS. 5C and 5D, the clamping members 504 are shown in a clampingposition; and the latch member 302 is extended below the tab 300 of thedoor 206 so as to hold the door 206 in a closed position as previouslydescribed (and as shown in FIG. 5C). As further shown in FIG. 5C, in theclamping position, the latch member 302 presses against the vertical leg508 of each clamping member 504 so as to press each clamping member 504through the apertures 511 into contact with the substrate 202.

FIG. 6A is a partial side view showing contact between one of theclamping members 504 and the substrate 202. As seen from FIG. 6A,contact with the substrate 202 may be made via a V-shaped groove 526formed in the end 514 of the horizontal leg 506 of the clamping member504. Other configurations than a V-shaped groove may be employed tocontact the substrate 202. For example, FIG. 6B is a cross sectionalview of the substrate carrier 112 of FIG. 5C, and FIG. 6C is a magnifiedisometric view showing details of a portion 525 of FIG. 6B, wherein theclamping members 504 have a flat groove 528 in the end 514 of thehorizontal leg 506. As stated, other configurations may be employed toprovide effective clamping of the substrate 202. As further shown inFIGS. 6B and 6C, the vertical leg 508 of each clamping member 504 isbiased against the latch member 302 (e.g., via a spring 530 or anothersuitable biasing mechanism).

To protect the substrate 202 from damage due to contaminants generatedby the latching mechanism 208 and/or due to contact between thesubstrate 202 and the clamping members 504 (1) a membrane (e.g., aflexible membrane 532, such as a diaphragm in FIG. 6C) may be employedto isolate the latching mechanism 208 from a clean substrate area 533 ofthe substrate carrier 112 in which the substrate 202 is located (asshown in FIGS. 6B and 6C); and/or (2) the end 514 of each clampingmember 504 may be provided with a “soft face” 534 for contacting thesubstrate 202 (as shown in FIG. 6A). For example, the flexible membrane532 may isolate the substrate 202 from all of the moving parts of thelatching mechanism 208 that may generate particles (e.g., the latchmember 302, the clamping members 504, the springs 530, etc.). Theflexible membrane 532 and/or the soft face 534 may comprise, forexample, a urethane, silicone, etc.

Referring again to FIG. 5B, a notch 536 is formed in the side 512 of thelatch member 302. When the substrate clamping mechanism 500 is in itsclamping position as shown in FIG. 5B, the notch 536 is positioned apredefined distance in a forward direction relative to the clampingmember 504 (as described further below). A similar notch, which is notshown, is similarly positioned relative to the other clamping member 504associated with the latch member 302 of FIG. 5B. Moreover, similarnotches (not shown) are provided in the other latch member 302 (FIG. 5Aand FIG. 6B), and are similarly positioned relative to the clampingmembers 504 associated with the other latch member 302.

FIGS. 7A and 7B are views that are respectively similar to FIGS. 5A and5B, but showing the substrate clamping mechanism 500 in a released(non-clamping) condition. FIG. 7B is a magnified view showing details ofa portion 700 of FIG. 7A.

With reference to FIGS. 5A and 5B and FIGS. 7A and 7B, releasing of theclamping mechanism 500 occurs as follows. A docking movement of thesubstrate carrier 112 is performed relative to the port 104 (FIG. 1).That is, the carrier housing 200 (represented by side wall 214 in FIGS.5B and 7B), the latch members 302, the clamping members 504 and thesubstrate 202 are moved together in the direction indicated by arrow 702in FIG. 5B (or arrow 410 in FIG. 4B). With reference to FIG. 5B, duringthe docking movement, the finger 310 of the latch member 302 comes intocontact with the stop 412 of the carrier opening mechanism 400 (FIG.4B). Accordingly, motion of the latch member 302 in the directionindicated by the arrow 702 is halted. The clamping member 504 advancesalong the latch member 302 until it reaches the notch 536. A biasingarrangement such as the spring 530 of FIGS. 6B and 6C may be employed tocause the clamping member 504 to enter the notch 536 so that theclamping member 504 moves away from, and out of contact with, thesubstrate 202. All four of the clamping members 504 (FIG. 5A) may movesubstantially simultaneously out of contact with the substrate 202 in asimilar manner, thereby releasing the substrate 202 from clamping. (Asan alternative to the above-mentioned biasing arrangement, the clampingmember 504, and in particular the vertical leg 508 thereof, may becoupled to the latch member 302 by a tongue-in-groove arrangement orother similar caming arrangement so that the clamping member 504 isdrawn into the notch 536 and away from the substrate 202.)

FIG. 7C is a cross sectional view similar to FIG. 6B, but with theclamping members 504 retracted into the notches 536 of each latch member302; FIG. 7D is a magnified isometric view showing details of a portion704 of FIG. 7C; and FIG. 7E is an isometric view of an embodiment of thesubstrate carrier 112 wherein a lid 706 of the substrate carrier 112 isremoved. As shown in FIGS. 7C-7E, as the substrate carrier 112 movesforward relative to each latch member 302, the spring 530 biases eachclamping member 504 against the latch 302 so that each clamping member504 enters its respective notch 536 by retracting away from thesubstrate 202 through aperture 511. The substrate 202 thereafter may beextracted from the substrate carrier 112 as described below.

With reference to FIGS. 1-7E, in operation, a substrate carrier 112,containing the substrate 202 to be processed in the processing tool 100,is placed on the support platform 110 of the substrate transfer location108 by, for example, a carrier handler robot (not shown) associated withthe factory interface 102. The controller 118 causes the door 106 (ifpresent) to be opened, and causes the carrier moving mechanism 114 todock the substrate carrier 112 with the port 104. The docking movementof the substrate carrier 112 brings the fingers 310 (FIG. 3) of thelatch members 302 into contact with stops 412 (FIG. 4B, only one shown)of the tunnel 402. As the substrate carrier 112 continues to advance,the latch members 302 are disengaged from the tabs 300 (only one shown,FIG. 3) and pushed into the enclosures 210. Meanwhile, the cam members408 (FIG. 3, only one shown) enter the cam slots 404 (FIG. 4B, only oneshown) of the tunnel 402 and are guided downwardly to pivot the door 206of the substrate carrier 112 down (as shown in FIGS. 2B, 2C and 7E). Atthe same time, the clamping members 504 travel into the notches 536(FIGS. 5B, 7B and 7D) of the latch members 302. The clamping members 504enter the notches 536, thereby moving away from the substrate 202 andreleasing the substrate 202 from clamping. In at least one embodiment,the notches 536 of each latch member 302 are positioned so that theclamping members 504 will be located within the notches 536 when the cammember 408 is at the bottom of the cam slot 404 and/or the door 206 isfully opened.

Since the door 206 (if present) has been unlatched and opened, and thesubstrate 202 has been unclamped, the substrate 202 is available forextraction from the substrate carrier 112. A substrate handling robot(not shown) of the factory interface 102 extracts the substrate 202 fromthe substrate carrier 112 and loads the substrate 202 into theprocessing tool 100. For example, a blade (not shown) of the substratehandler may extend below the substrate 202 (e.g., in region 533 of thesubstrate carrier 112 (FIG. 7C)) and lift the substrate 202 past thehollowed out region 520 to area 708 of the substrate carrier 112 (FIG.7B). The substrate 202 then may be loaded into the processing tool 100.The substrate 202 is processed in the processing tool 100. After theprocessing of the substrate 202 is complete, the substrate handlingrobot returns the substrate 202 to the substrate carrier 112.

The carrier moving mechanism 114 then undocks the substrate carrier 112from the port 104. The undocking movement of the substrate carrier 112causes the cam followers 408 to be guided upwardly in the cam slots 404,to close the door 206. As the carrier housing 200 is moved away from thestops 412 of the carrier opening mechanism 400, the biasing force of thesprings 312 urges the latch members 302 outwardly from the enclosure210, bringing the fingers 310 into engagement with the tabs 300 on thedoor 206. Thus the door 206 is again latched in a closed position.

By the same movement of the latch members 302, notches 536 (FIGS. 5B,7B) in the latch members 302 are moved away from the clamping members504. In response thereto, the sides 512 of the latch members 302 forcethe clamping members 504 into contact with the substrate 202, therebyclamping the substrate 202. The latched substrate carrier 112, with thesubstrate 202 clamped therein, is now ready to be transported away fromthe substrate transfer location 108 and may be moved to anotherprocessing tool for further processing or to another location in thefabrication facility.

The present invention provides for secure latching of the door of asubstrate carrier, and secure clamping of a substrate within thesubstrate carrier. As a result, rough handling or damage to thesubstrate and/or particulate contamination of the substrate, may beavoided.

The foregoing description discloses only exemplary embodiments of theinvention; modifications of the above disclosed apparatus which fallwithin the scope of the invention will be readily apparent to those ofordinary skill in the art. For example, although the present inventionis illustrated with respect to single substrate carriers, it is alsocontemplated to apply the present invention to substrate carriers thathold more than one substrate. “Single substrate carrier” will beunderstood to mean a substrate carrier shaped and sized to contain onlyone substrate at a time.

As illustrated herein the inventive substrate carrier includes both aninventive latching mechanism and an inventive substrate clampingmechanism. However, it is also contemplated in accordance with theinvention to provide a substrate carrier that includes a latchingmechanism without a substrate clamping mechanism, or to provide asubstrate carrier having a substrate clamping mechanism without alatching mechanism. Alternatively or additionally, the clamping members504 may be configured to rotate away from the substrate 202.

The present invention may be used in conjunction with any processingtool such as one which performs one or more of the following:deposition, oxidation, etching, thermal processing, photolithography,etc. Instead of employing the inventive substrate transfer location at afactory interface, the inventive substrate transfer location may beemployed directly at a load lock of a processing tool or at any othersuitable location.

The present invention has been illustrated in connection withinterfacing a substrate carrier to a processing tool. However, thepresent invention is equally applicable to interfacing a substratecarrier to a metrology location, to a chemical/mechanical polishing(CMP) device, or to any other location or device to which a substratemay be transported in a substrate carrier.

Instead of the support platform 110 and the carrier moving mechanism 114illustrated herein, the substrate transfer location 108 may have agripper (not shown) which functions as a substrate carrier supportstructure and is adapted to grip the substrate carrier 112 (e.g., by atop flange of the substrate carrier) and to move the substrate carrier112 toward and away from the port 104, as disclosed in previouslyincorporated U.S. patent application Ser. No. 60/407,337, filed Aug. 31,2002 titled “Wafer Loading Station with Docking Grippers at DockingStations”. For example, FIG. 8 is an isometric view of an alternativeembodiment of a substrate loading station that may include a substratecarrier handler that may be employed with the present invention. In FIG.8, reference numeral 801 indicates the alternative substrate loadingstation. Reference numeral 803 indicates an alternative substratecarrier handler. The substrate loading station 801 of FIG. 8 may begenerally similar to an embodiment of a loading station disclosed inabove-referenced co-pending U.S. patent application Ser. No. 60/407,337,filed Aug. 31, 2002 and titled “Wafer Loading Station with DockingGrippers at Docking Stations”.

The substrate carrier handler 803 of FIG. 8 includes a pair of verticalguides 805, 807 and a horizontal guide 809 which is mounted for verticalmovement on the vertical guides 805, 807. A support 811 is mounted onthe horizontal guide 809 for horizontal movement along the horizontalguide 809. An end effector 813 is mounted on the support 811. The endeffector 813 may comprise, for example, an end effector capable ofchanging the orientation of a substrate carrier from vertical tohorizontal and vice versa as described in previously incorporated U.S.patent application Ser. No. 60/407,452, filed Aug. 31, 2002 and titled“End Effector Having Mechanism For Reorienting A Wafer Carrier BetweenVertical And Horizontal Orientations”. Any other suitable end effectoralso may be employed, such as an end effector which grips a substratecarrier via an overhead transfer flange of the substrate carrier.

It will be observed that the substrate loading station 801 has twocolumns of docking stations 815, although fewer or more columns ofdocking stations may be employed. Each docking station 815 includes aplurality of docking grippers 817. Each docking gripper 817 is adaptedto support a substrate carrier via its overhead transfer flange, and todock and undock a substrate carrier (as previously described).Alternatively, the docking grippers may be replaced with dockingplatforms that support a substrate carrier (e.g., via the substratecarrier's bottom surface) and that move toward and away from thecleanroom wall (or front wall of a chamber such as a factory interfacechamber) to which the docking platform is mounted.

Preferably, the substrate loading station 801 comprises a frame F towhich the vertical and horizontal guides 805, 807 and 809 are coupled.In this manner, the preferred substrate loading station 801 is modularand may be quickly installed and calibrated. In the event the substrateloading station 801 includes one or more storage shelves S (shown inphantom), the storage shelf S also may be mounted on the frame F. Bymounting both the substrate carrier handler and the storage shelf orshelves to the frame, the substrate carrier handler and storage shelveshave a predetermined position relative to each other. This furtherfacilitates installation and calibration, and is another advantage ofemploying a modular substrate loading station. Similarly, othermechanisms such as dedicated mechanisms for loading and/or unloadingsubstrate carriers from an overhead factory transport system may beadvantageously mounted to the frame F as described, for example, inpreviously incorporated U.S. patent application Ser. No. 60/407,451,filed Aug. 31, 2002 and titled “System For Transporting Wafer Carriers”.

In one aspect, the frame F may be mounted to predetermined mountinglocations (e.g., predrilled bolt holes, etc.) on the clean room wall, oron the front wall of a chamber (e.g., a factory interface chamber).Preferably, the wall also has predetermined mounting locations to whichthe docking grippers or docking platforms are mounted. Additionally, thewall may have predetermined mounting locations to which a substratecarrier opening mechanism 400 may be mounted. When the frame F, thedocking mechanisms, and the substrate carrier opening mechanism are eachmounted to predetermined locations on the same surface, the relativepositions of each are predetermined, and installation and calibration ofthe substrate loading station 801 is facilitated.

While the present invention has been disclosed in connection withexemplary embodiments thereof, it should be understood that otherembodiments may fall within the spirit and scope of the invention, asdefined by the following claims.

1. An apparatus for opening a door of a substrate carrier, comprising: acarrier opening mechanism adapted to: support the substrate carrier doorat a substrate transfer location; and pivot the door below a bottomsurface of the substrate carrier; wherein: the carrier opening mechanismincludes at least one channel; and the door includes at least onefeature adapted to slide within the at least one channel so as to pivotthe door below the bottom surface of the substrate carrier.
 2. Theapparatus of claim 1 wherein the carrier opening mechanism is furtheradapted to pivot the door below the bottom surface of the substratecarrier such that a front of the door is approximately parallel to thebottom surface of the substrate carrier.
 3. The apparatus of claim 1wherein a front of the pivoted door faces away from the bottom surfaceof the substrate carrier.
 4. The apparatus of claim 1 wherein thecarrier opening mechanism is further adapted to unlatch the door fromthe substrate carrier.
 5. A method of opening a door of a substratecarrier, comprising: moving the substrate carrier such that the door ofthe substrate carrier contacts a carrier opening mechanism; employingthe carrier opening mechanism to support the door; and pivoting the doorbelow a bottom surface of the substrate carrier, wherein pivoting thedoor below a bottom surface of the substrate carrier comprises moving atleast one feature of the door along a channel of the carrier openingmechanism.
 6. The method of claim 5 wherein pivoting the door below thebottom surface of the substrate carrier includes pivoting the door belowthe bottom surface of the substrate carrier such that a front of thedoor is approximately parallel to the bottom surface of the substratecarrier.
 7. The method of claim 5 wherein pivoting the door below thebottom surface of the substrate carrier includes pivoting the door belowa bottom surface of the substrate carrier such that a front of thepivoted door faces away from the bottom surface of the substratecarrier.
 8. The method of claim 5 further comprising employing thecarrier opening mechanism to unlatch the door from the substratecarrier.